Exposed metal bezel for use in sensor devices and method therefor
US7859116B1 · kind B1 · utility
7Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2006 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Apr 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package has a substrate. A sensor die having an inactive surface is bonded to the substrate. An active surface of the sensor die is exposed. A portion of the active surface of the sensor die has an active imaging area. A metal bezel is formed on the active surface of the sensor die and separate from the imaging area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.