Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a multi-part electrode
US7861667B2 · kind B2 · utility
16Cited by
37References
31Claims
0Family size
Assignee
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Key dates
| Filing date | May 23, 2003 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Sep 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32009
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved upper electrode system has a multi-part electrode in which a central portion of the electrode having high wear is replaceable independent of an outer peripheral portion of the electrode. The upper electrode can be used in plasma processing systems for processing semiconductor substrates, such as by etching or CVD. The multi-part upper electrode system is particularly useful for large size wafer processing chambers, such as 300 mm wafer processing chambers for which monolithic electrodes are unavailable or costly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.