Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
US7888184B2 · kind B2 · utility
13Cited by
22References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | May 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.