Method and apparatus for processing a micro sample
US7888639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Jan 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L69/329
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.