Semiconductor process
US7892935B2 · kind B2 · utility
1Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2006 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Nov 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0223
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor process is provided. The semiconductor process includes providing a substrate. Then, a surface treatment is performed to the substrate to form a buffer layer on the substrate. Next, a first pre-amorphous implantation is performed to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.