Patent · US Active

External contact material for external contacts of a semiconductor device and method of making the same

US7893532B2 · kind B2 · utility

1Cited by

4References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Irmgard Escher-Poeppel · Regensburg, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Bernd Rakow · Regensburg, DE
Peter Strobel · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Sep 13, 2006
Grant date	Feb 22, 2011
Priority date	—
Expiry date	Oct 8, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1163
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.