Apparatus and methods for transporting and processing substrates
US7901539B2 · kind B2 · utility
21Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Dec 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.