Detachable electrostatic chuck for supporting a substrate in a process chamber
US7907384B2 · kind B2 · utility
9Cited by
88References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2008 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Feb 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular flange. A spring loaded heat transfer plate contacts the base plate, and has a fluid channel comprising first and second spiral channels. A pedestal is below the heat transfer plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.