Plasma processing method
US7909933B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2009 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | May 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67213
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a plasma processing method capable of reducing particle caused by flinging up of particles by airflow due to the pressure fluctuation in the processing chamber during the time the sample is carried into the processing chamber, subjected to plasma processing and carried out of the processing chamber. The invention provides a plasma processing method using a plasma processing apparatus comprising multiple plasma processing chambers for processing samples, a transfer chamber connected to the processing chambers for transferring samples, and a supply system for supplying gas which is the same gas as a transferring gas supplied to the transfer chamber to both the processing chambers and transfer chamber or to only the processing chambers, wherein the process comprises (b) a step of transferring the sample into the processing chamber with the transferring gas supplied to the processing chamber; (c) thereafter, generating plasma from the transferring gas supplied to the processing chamber while maintaining the supply of transferring gas to the processing chamber; (d) a step of switching the gas supplied to the processing chamber from transferring gas to processing g…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.