Patent · US Active

Component arrangement comprising a carrier

US7911039B2 · kind B2 · utility

1Cited by

11References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Alfred Haimerl · Sinzing, DE
Angela Kessler · Regensburg, DE
Joachim Mahler · Regensburg, DE
Wolfgang Schober · Amberg, DE

Key dates

Filing date	Sep 25, 2007
Grant date	Mar 22, 2011
Priority date	—
Expiry date	Mar 9, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/049
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.