Electroless deposition system
US7913644B2 · kind B2 · utility
1Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2006 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Dec 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/187
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.