Integrated circuit packaging system with base structure device
US7915724B2 · kind B2 · utility
5Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Mar 29, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.