Patent · US Active

Plastic housing and semiconductor component with said plastic housing

US7919857B2 · kind B2 · utility

0Cited by

4References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Peter Strobel · Regensburg, DE
Jens Pohl · San Luis Obispo, US
Christian Stuempfl · Schmidgaden, DE
Ludwig Heitzer · Regensburg, DE

Key dates

Filing date	Oct 4, 2007
Grant date	Apr 5, 2011
Priority date	—
Expiry date	May 6, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.