Patent · US Active

Multi-station deposition apparatus and method

US7923069B2 · kind B2 · utility

2Cited by

14References

10Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Mei Chang · San Jose, US
Lawrence Chung-Lai Lei · Milpitas, US
Walter Glenn · Pacifica, US

Key dates

Filing date	Aug 20, 2010
Grant date	Apr 12, 2011
Priority date	—
Expiry date	Aug 20, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6719
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.