Patent · US Active

Nano imprint technique with increased flexibility with respect to alignment and feature shaping

US7928004B2 · kind B2 · utility

8Cited by

4References

6Claims

0Family size

Assignee

Advanced Micro Devices, Inc. · US

Inventors

Robert Seidel · Dresden, DE
Carsten Peters · Dresden, DE
Frank Feustel · Dresden, DE

Key dates

Filing date	Feb 6, 2007
Grant date	Apr 19, 2011
Priority date	—
Expiry date	May 8, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/1021
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.