Segmentation of a die stack for 3D packaging thermal management

US7928562B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Amilcar R. Arvelo · Poughkeepsie, US
• Evan G. Colgan · Chestnut Ridge, US
• John Harold Magerlein · Yorktown Heights, US
• Kenneth C. Marston · Poughquag, US
• Kathryn C. Rivera · Hopewell Junction, US
• Kamal K. Sikka · Poughkeepsie, US
• Jamil A. Wakil · Austin, US
• Xiaojin Wei · Poughkeepsie, US
• Jeffrey A. Zitz · Poughkeepsie, US

Key dates

• Filing date: Jul 22, 2008
• Grant date: Apr 19, 2011
• Expiry date: Mar 12, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16251
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.