Rapidly cleanable electroplating cup assembly

US7935231B2 · kind B2 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Shantinath Ghongadi · Tigard, US
• Robert Rash · Portland, US
• Jeff Hawkins · Portland, US
• Seshasayee Varadarajan · Lake Oswego, US
• Tariq Majid · Wilsonville, US
• Kousik Ganesan · Tualatin, US
• Bryan L. Buckalew · Tualatin, US
• Brian Charles Evans · Eugene, US

Key dates

• Filing date: Oct 31, 2007
• Grant date: May 3, 2011
• Expiry date: Aug 30, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D21/08
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.