Patent · US Active

Support with solder ball elements and a method for populating substrates with solder balls

US7935622B2 · kind B2 · utility

6Cited by

8References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Thomas Bemmerl · Schwandorf, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Herman Vilsmeier · Karlsfeld, DE

Key dates

Filing date	May 17, 2005
Grant date	May 3, 2011
Priority date	—
Expiry date	Jan 2, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/041
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.