Process for cleaning a semiconductor wafer using a cleaning solution

US7938911B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Clemens Zapilko · Burghausen, DE
• Thomas Buschhardt · Burghausen, DE
• Diego Feijoo · Burghausen, DE
• Guenter Schwab · Vilshofen an der Donau, DE

Key dates

• Filing date: Jun 17, 2008
• Grant date: May 10, 2011
• Expiry date: May 9, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Semiconductor wafers are cleaned using a cleaning solution containing an alkaline ammonium component in an initial composition, wherein the semiconductor wafer is brought into contact with the cleaning solution in an individual-wafer treatment, and in the course of cleaning hydrogen fluoride is added as further component to the cleaning solution, and the cleaning solution has at the end of cleaning, a composition that differs from the initial composition.