Configurable bevel etcher
US7943007B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jan 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/335
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for cleaning a bevel edge of a semiconductor substrate. The device includes: a lower support having a cylindrical top portion; a lower plasma-exclusion-zone (PEZ) ring surrounding the outer edge of the top portion and adapted to support the substrate; an upper dielectric component opposing the lower support and having a cylindrical bottom portion; an upper PEZ ring surrounding the outer edge of the bottom portion and opposing the lower PEZ ring; and at least one radiofrequency (RF) power source operative to energize process gas into plasma in an annular space defined by the upper and lower PEZ rings, wherein the annular space encloses the bevel edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.