Optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
US7952694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2010 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Sep 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3299
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A disclosed device comprises an edge bonding seal configured to be mounted to an edge bead of the electrostatic chuck. The edge bonding seal includes a monitoring layer comprised of a first material configured to emit a species capable of being optically monitored. The edge bonding seal further includes an edge bonding layer configured to be interspersed at least between the monitoring layer and the plasma environment. The edge bonding layer is comprised of a second material susceptible to erosion due to reaction with the plasma environment and configured to expose the monitoring layer to the plasma environment upon sufficient exposure to the plasma environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.