Implementing enhanced wiring capability for electronic laminate packages

US7954081B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Gerald K. Bartley · Rochester, US
• Darryl J. Becker · Rochester, US
• Paul Eric Dahlen · Rochester, US
• Philip Raymond Germann · Oronoco, US
• Andrew Benson Maki · Rochester, US
• Mark O. Maxson · Mantorville, US
• Trevor Joseph Timpane · Rochester, US

Key dates

• Filing date: Nov 21, 2008
• Grant date: May 31, 2011
• Expiry date: Jul 18, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/3452
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Structures and a computer program product are provided for implementing enhanced wiring capability for electronic laminate packages. Electronic package physical design data are received. Instances of line width and space limit violations in the electronic package physical design data are identified. The identified instances of line width and space limit violations are evaluated using predefined qualified options and tolerance limitations and the electronic package physical design data are modified to optimize shapes to replace the instances of line width and space limit violations.