Patent · US Active

Method for smoothing wafer surface and apparatus used therefor

US7955982B2 · kind B2 · utility

0Cited by

7References

7Claims

0Family size

Assignee

SUMCO CORPORATION · JP

Inventors

Takeo Katoh · Tokyo, JP
Tomohiro Hashii · Tokyo, JP
Katsuhiko Murayama · Tokyo, JP
Sakae Koyata · Tokyo, JP
Kazushige Takaishi · Tokyo, JP

Key dates

Filing date	Jan 17, 2007
Grant date	Jun 7, 2011
Priority date	—
Expiry date	Nov 28, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6708
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed is a method for smoothing the surface of at least one side of a wafer which is obtained by slicing a semiconductor ingot. In this method, a fluid is applied according to projections of the wafer surface, thereby reducing the projections. Alternatively, a fluid is applied over the wafer surface, thereby smoothing the entire surface of the wafer while reducing the projections in the wafer surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.