Takeo Katoh
14Patents
3h-index
18Co-inventors
53Inventor score
Filing activity: Apr 2, 2004 → Jan 14, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7491342B2 | Bonded semiconductor substrate manufacturing method thereof | Electricity | 31 | Expired |
| US7488400B2 | Apparatus for etching wafer by single-wafer process | Emerging Cross-Sectional Technologies | 3 | Active |
| US8147295B2 | Method of polishing silicon wafer | Electricity | 3 | Active |
| US7601644B2 | Method for manufacturing silicon wafers | Electricity | 3 | Expired |
| US8379196B2 | Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method | Physics | 2 | Active |
| US7906438B2 | Single wafer etching method | Electricity | 2 | Active |
| US8466071B2 | Method for etching single wafer | Electricity | 2 | Active |
| US8877643B2 | Method of polishing a silicon wafer | Emerging Cross-Sectional Technologies | 1 | Active |
| US8759229B2 | Method for manufacturing epitaxial wafer | Electricity | 1 | Active |
| US7648890B2 | Process for producing silicon wafer | Electricity | 0 | Active |
| US10177008B2 | Silicon wafer and method for manufacturing the same | Electricity | 0 | Active |
| US7833908B2 | Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same | Electricity | 0 | Expired |
| US8066896B2 | Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US7955982B2 | Method for smoothing wafer surface and apparatus used therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.