Integrated circuit protruding pad package system
US7968377B2 · kind B2 · utility
1Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2005 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Sep 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.