MEEF reduction by elongation of square shapes
US7975246B2 · kind B2 · utility
1Cited by
47References
20Claims
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Key dates
| Filing date | Aug 14, 2008 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Aug 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method that purposely relaxes OPC algorithm constraints to allow post OPC mask shapes to elongate along one direction (particularly lowering the 1-dimensional MEEF in this direction with the result of an effectively overall lowered MEEF) to produce a pattern on wafer that is circular to within an acceptable tolerance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.