Method and system for thermally processing a plurality of wafer-shaped objects

US7977258B2 · kind B2 · utility

Assignee

• Mattson Technology, Inc. · US

Inventors

• Zsolt Nenyei · Blaustein, DE
• Paul Janis Timans · Mountain View, US
• Wilfried Lerch · Blaustein, DE
• Juergen Niess · Sontheim, DE
• Manfred Falter · Ulm, DE
• Patrick Schmid · Muttenz, CH
• Conor Patrick O'Carroll · Sunnyvale, US
• Rudy Santo Tomas Cardema · San Jose, US
• Igor Fidelman · Nesher, IL
• Sing-Pin Tay · Ottawa, CA
• Yao Zhi Hu · San Jose, US
• Daniel J. Devine · Seattle, US

Key dates

• Filing date: Apr 6, 2007
• Grant date: Jul 12, 2011
• Expiry date: Jul 24, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67115
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.