Platen exhaust for chemical mechanical polishing system
US7988535B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jan 29, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention generally relates to a substrate transferring system. Particularly, the present invention relates to apparatus and method to effectively remove the chemical fume, vapor and other byproducts generated during a polishing process. One embodiment of the present invention provides an apparatus for polishing a substrate comprising a platen having a polishing surface configured to polish the substrate by contacting the substrate while moving relatively to the substrate, a polishing head configured to support the substrate and position the substrate to be in contact with the polishing surface during polishing, a solution nozzle configured to dispense a polishing solution on the polishing surface, and an exhaust assembly configured to remove fume, vapor and other byproducts generated during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.