Lead free alloy bump structure and fabrication method
US7994043B1 · kind B1 · utility
4Cited by
28References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Aug 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes forming a patterned resist layer comprising a resist layer opening overlying a bond pad of a substrate. The resist layer opening is at least partially filled with a first solder component layer. A second solder component layer is formed on the first solder component layer. The patterned resist layer is removed. The first solder component layer and the second solder component layer are reflowed to form a lead free binary metal alloy solder bump electrically connected to the bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.