Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

US8010222B2 · kind B2 · utility

Assignee

• KLA-Tencor Technologies Corp. · US

Inventors

• Kurt Lehman · Menlo Park, US
• Charles Chen · Sunnyvale, US
• Ronald L. Allen · San Jose, US
• Robert Shinagawa · Cupertino, US
• Anantha R. Sethuraman · Palo Alto, US
• Christopher F. Bevis · Los Gatos, US
• Thanassis Trikas · Redwood City, US
• Haiguang Chen · Millbrae, US
• Ching-Ling Meng · Fremont, US

Key dates

• Filing date: Feb 15, 2008
• Grant date: Aug 30, 2011
• Expiry date: Nov 15, 2029

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/12
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.