Patent · US Active

Method for producing chip packages, and chip package produced in this way

US8012807B2 · kind B2 · utility

21Cited by

1References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Harry Hedler · Germering, DE
Markus Brunnbauer · Lappersdorf, DE

Key dates

Filing date	Jul 12, 2007
Grant date	Sep 6, 2011
Priority date	—
Expiry date	May 26, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.