Thin substrate fabrication method and structure
US8017436B1 · kind B1 · utility
24Cited by
16References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2007 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.