Patent · US Active

Semiconductor module with at least two substrates

US8017438B2 · kind B2 · utility

3Cited by

5References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Angela Kessler · Regensburg, DE
Wolfgang Schober · Amberg, DE
Alfred Haimerl · Sinzing, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Dec 19, 2006
Grant date	Sep 13, 2011
Priority date	—
Expiry date	Dec 2, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors. A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.