CMOS devices having stress-altering material lining the isolation trenches and methods of manufacturing thereof
US8017472B2 · kind B2 · utility
2Cited by
2References
31Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 17, 2006 |
| Grant date | Sep 13, 2011 |
| Priority date | — |
| Expiry date | May 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0188
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and methods of manufacturing thereof are disclosed. Isolation regions are formed that include a stress-altering material at least partially lining a trench formed within a workpiece. The isolation regions include an insulating material disposed over the stress-altering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.