Patent · US Active

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

US8030744B2 · kind B2 · utility

0Cited by

8References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Laska · Birkenfeld, DE
Matthias Stecher · Munich, DE
Gregory Bellynck · Donaustauf, DE
Khalil Hosseini · Weihmichl, DE
Joachim Mahler · Regensburg, DE

Key dates

Filing date	Apr 29, 2010
Grant date	Oct 4, 2011
Priority date	—
Expiry date	Apr 29, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/2076
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one embodiment, a metallic layer is deposited onto at least one contact terminal and/or the contacts and the wire, the metallic layer protecting the contact terminal or the electrical connection against ambient influences and ensuring a high reliability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.