Substrate processing system
US8033244B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Apr 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Leakage of an atmosphere of a solvent vapor used by a smoothing process for smoothing the surface of a resist pattern outside from a smoothing unit is prevented to facilitate incorporating the smoothing unit into a coating and developing system. A substrate processing system has a coating and developing block 20, a smoothing block 50, an airflow producing unit 60 for producing down airflow that flows down from above the coating and developing block 20 and the smoothing block 50, and a main controller 100 for controlling the airflow producing unit 60. The main controller 100 controls a flow regulating valve 64a placed in an air passage 63a connecting the airflow producing unit 60 to the coating and developing block 20 and a flow regulating valve 64b placed in an air passage 63b connecting the airflow producing unit 60 to the smoothing block 50 on the basis of a signal provided by a pressure sensor 65a for measuring the pressure in the coating and developing block 20 and a signal provided by a pressure sensor 65b for measuring the pressure in the smoothing block 50 such that the pressure in the smoothing block 50 is lower than that in the coating and developing block 20.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.