Using optical metrology for within wafer feed forward process control
US8039397B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2009 |
| Grant date | Oct 18, 2011 |
| Priority date | — |
| Expiry date | Nov 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.