Process of forming ultra thin wafers having an edge support ring
US8048775B2 · kind B2 · utility
5Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2007 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Mar 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.