Inventor · Santa Clara, CA, US

Tao Feng

125Patents
9h-index
175Co-inventors
83Inventor score

Filing activity: Mar 23, 1998 → May 13, 2025

Most-cited inventions

PatentTitleAreaCited byStatus
US7868431B2 Compact power semiconductor package and method with stacked inductor and integrated circuit die Electricity 59 Active
US9815211B2 Rotary joint of a robot and the robot including the same Electricity 56 Active
US7884696B2 Lead frame-based discrete power inductor Electricity 37 Active
USD800813S1 Industrial robot General 28 Active
USD776735S1 Industrial robot General 25 Active
USD839942S1 Industrial robot General 13 Active
US8450151B1 Micro surface mount device packaging Electricity 12 Active
US7842543B2 Wafer level chip scale package and method of laser marking the same Electricity 10 Active
US7948346B2 Planar grooved power inductor structure and method Emerging Cross-Sectional Technologies 9 Active
US7373618B1 Method and system for selection and replacement of subcircuits in equivalence checking Physics 9 Active
US8217748B2 Compact inductive power electronics package Emerging Cross-Sectional Technologies 9 Active
US7776746B2 Method and apparatus for ultra thin wafer backside processing Electricity 8 Active
US8846532B2 Method and apparatus for ultra thin wafer backside processing Electricity 8 Active
US7955893B2 Wafer level chip scale package and process of manufacture Electricity 8 Active
US7977740B2 Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling Electricity 8 Active
US10617366B2 Imaging systems and methods thereof Human Necessities 6 Active
US8053891B2 Standing chip scale package Electricity 5 Active
US9958559B1 Method and apparatus for automatic detection and correction of patient bed shift using intrinsic scintillation crystal radiations Physics 5 Active
US6123432A Adjustable mounting assembly for mounting a fluorescent lighting device Mechanical Engineering; Lighting; Heating 5 Expired
US7811904B2 Method of fabricating a semiconductor device employing electroless plating Electricity 5 Active
US8048775B2 Process of forming ultra thin wafers having an edge support ring Emerging Cross-Sectional Technologies 5 Active
US7971340B2 Planar grooved power inductor structure and method Emerging Cross-Sectional Technologies 4 Active
US8981464B2 Wafer level chip scale package and process of manufacture Electricity 4 Active
US10347460B2 Patterned substrate imaging using multiple electron beams Electricity 4 Active
US7670908B2 Configuration of high-voltage semiconductor power device to achieve three dimensional charge coupling Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.