System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US8050900B2 · kind B2 · utility
8Cited by
36References
50Claims
0Family size
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Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Jan 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method, system, and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is performed using the input data and the physical model to provide a virtual sensor measurement relating to the process performed by the semiconductor processing tool, and the virtual sensor measurement is used to facilitate the process performed by the semiconductor processing tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.