Eric J. Strang
63Patents
18h-index
27Co-inventors
80Inventor score
Filing activity: Oct 24, 2001 → Jul 15, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6740853B1 | Multi-zone resistance heater | Electricity | 639 | Expired |
| US6872259B2 | Method of and apparatus for tunable gas injection in a plasma processing system | Electricity | 560 | Expired |
| US7723648B2 | Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system | Electricity | 528 | Active |
| US7166233B2 | Pulsed plasma processing method and apparatus | Electricity | 275 | Expired |
| US7311782B2 | Apparatus for active temperature control of susceptors | Electricity | 80 | Expired |
| US7164236B2 | Method and apparatus for improved plasma processing uniformity | Electricity | 55 | Expired |
| US6806949B2 | Monitoring material buildup on system components by optical emission | Physics | 43 | Expired |
| US7740704B2 | High rate atomic layer deposition apparatus and method of using | Chemistry; Metallurgy | 41 | Active |
| US8852347B2 | Apparatus for chemical vapor deposition control | Electricity | 36 | Active |
| US9139910B2 | Method for chemical vapor deposition control | Chemistry; Metallurgy | 35 | Active |
| US7075031B2 | Method of and structure for controlling electrode temperature | Electricity | 33 | Expired |
| US6894769B2 | Monitoring erosion of system components by optical emission | Physics | 32 | Expired |
| US8927907B2 | Thermally zoned substrate holder assembly | Emerging Cross-Sectional Technologies | 32 | Active |
| US7019253B2 | Electrically controlled plasma uniformity in a high density plasma source | Electricity | 28 | Expired |
| US7666479B2 | Apparatus and method of gas injection sequencing | Emerging Cross-Sectional Technologies | 26 | Active |
| US6949722B2 | Method and apparatus for active temperature control of susceptors | Electricity | 20 | Expired |
| US6753498B2 | Automated electrode replacement apparatus for a plasma processing system | Electricity | 20 | Expired |
| US6806653B2 | Method and structure to segment RF coupling to silicon electrode | Electricity | 19 | Expired |
| US6642661B2 | Method to affect spatial distribution of harmonic generation in a capacitive discharge reactor | Electricity | 16 | Expired |
| US7347901B2 | Thermally zoned substrate holder assembly | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6913703B2 | Method of adjusting the thickness of an electrode in a plasma processing system | Electricity | 13 | Expired |
| US7582186B2 | Method and apparatus for an improved focus ring in a plasma processing system | Electricity | 12 | Expired |
| US8014991B2 | System and method for using first-principles simulation to characterize a semiconductor manufacturing process | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6954077B2 | Apparatus and method for improving microwave coupling to a resonant cavity | Electricity | 11 | Expired |
| US7103443B2 | Directed gas injection apparatus for semiconductor processing | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.