Patent · US Active

Multi lead frame power package

US8053876B2 · kind B2 · utility

2Cited by

8References

7Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Steven Kummerl · Carrollton, US
Bernhard Lange · Gerolzhofen, DE
Anthony L. Coyle · Allen, US

Key dates

Filing date	Oct 5, 2009
Grant date	Nov 8, 2011
Priority date	—
Expiry date	Oct 5, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.