Chip scale power converter package having an inductor substrate
US8058960B2 · kind B2 · utility
13Cited by
7References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2007 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Jan 21, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip scale power converter package having an inductor substrate and a power integrated circuit flipped onto the inductor substrate is disclosed. The inductor substrate includes a high resistivity substrate having a planar spiral inductor formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.