Substrate processing sequence in a Cartesian robot cluster tool

US8066466B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mike Rice · Pleasanton, US
• Jeffrey C. Hudgens · San Francisco, US
• Charles T. Carlson · Cedar Park, US
• William T. Weaver · Austin, US
• Robert B. Lowrance · Los Gatos, US
• Eric A. Englhardt · Palo Alto, US
• Dean C. Hruzek · Cedar Park, US
• Dave Silvetti · معلمی نژاد, US
• Michael Kuchar · Georgetown, US
• Kirk Van Katwyk · Tracy, US
• Van Hoskins · Round Rock, US
• Vinay Shah · San Mateo, US

Key dates

• Filing date: Jul 20, 2010
• Grant date: Nov 29, 2011
• Expiry date: Jul 20, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S414/135
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.