Semiconductor device with cooling element
US8072061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2010 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Mar 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor also has at least one cooling element formed at least in part of a material having a heat capacity equal to or larger than the heat capacity of the material of the source region, drain region and array of fins, the cooling elements being in close vicinity to fins of the array of fins electrically isolated from the fins of the array, the source region and the drain region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.