Method and device employing polysilicon scaling

US8076199B2 · kind B2 · utility

Assignee

• Spansion LLC. · US

Inventors

• Shenqing Fang · Fremont, US
• Chun Chen · San Jose, US
• Wenmei Li · San Jose, US
• Inkuk Kang · San Jose, US
• Gang Xue · Beijing, CN
• Hyesook Hong · Allen, US

Key dates

• Filing date: Feb 13, 2009
• Grant date: Dec 13, 2011
• Expiry date: May 16, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D30/0227

Abstract

A memory and method of manufacture employing word line scaling. A layered stack, including a charge trapping component and a core polysilicon layer, is formed on a core section and a peripheral section of a substrate. A portion of the layered stack, including the core polysilicon layer is then removed from the peripheral section. A peripheral polysilicon layer, which is thicker than the core polysilicon layer of the layered stack, is next formed on the layered stack and the peripheral section. The layered stack is then isolated from the peripheral polysilicon layer by removing a portion of the peripheral polysilicon layer from the core section, and polysilicon lines are patterned in the isolated layered stack.