Patent · US Active

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

US8080880B2 · kind B2 · utility

5Cited by

1References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Brunnbauer · Lappersdorf, DE
Jens Pohl · San Luis Obispo, US
Thorsten Meyer · Regensburg, DE

Key dates

Filing date	Mar 20, 2009
Grant date	Dec 20, 2011
Priority date	—
Expiry date	Jan 28, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.