Method for a bin ratio forecast at new tape out stage
US8082055B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2009 |
| Grant date | Dec 20, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06Q30/0202
- WIPO fieldIT methods for management
- WIPO sectorElectrical engineering
Abstract
A method for providing a bin ratio forecast at an early stage of integrated circuit device manufacturing processes is disclosed. The method comprises collecting historical data from one or more processed wafer lots; collect measurement data from one or more skew wafer lots; generating an estimated baseline distribution from the collected historical data and collected measurement data; generating an estimated performance distribution based on one or more specified parameters and the generated estimated baseline distribution; determining a bin ratio forecast by applying a bin definition and a yield degradation factor estimation to the generated estimated performance distribution; determining one or more production targets based on the bin ratio forecast; and processing one or more wafers based on the one or more determined production targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.