Methods for discretized processing and process sequence integration of regions of a substrate
US8084400B2 · kind B2 · utility
11Cited by
56References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2006 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Nov 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/8593
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is processed by delivering materials to or modifying regions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.