Test structures for development of metal-insulator-metal (MIM) devices
US8084770B2 · kind B2 · utility
0Cited by
7References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 17, 2008 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Nov 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the present electronic test structure comprising, a conductor is provided, overlying a substrate. An electronic device overlies a portion of the conductor and includes a first electrode connected to the conductor, a second electrode, and an insulating layer between the first and second electrodes. A portion of the conductor is exposed for access thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.